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EDT Solutions & Imaging
EDT Solutions & Imaging EDT Digital Camera Interfaces 3x3G Mezzanine

EDT Digital Camera Interfaces Optical and electrical telecommunications

3x3G Mezzanine

 

3x3G Mezzanine

Three-channel interface for up to three Gb/s serial data (or 1GbE) per channel

The 3x3G is a mezzanine board that pairs with an EDT main board (for PCI or PCI Express) for high-speed data transfer. It has three channels, each having one 3Gb Xilinx RocketIO transceiver and one SFP for either an electrical RJ45 1GbE (1000 Base-T) Ethernet adapter or an optical LC.

Four additional RocketIO transceivers connect to an internal 40-pin connector. Two quad-frequency oscillators allow eight different clock speecs.

Four additional RocketIO transceivers connect to an internal 40-pin connector. Two quad-frequency oscillators allow eight different clock speeds.

For details on system requirements and EDT-provided software driver packages, see specifications for your EDT main board (PCI SS, PCI GS, or PCIe8 LX).

Data sheet / Specifications

 
 
 
 
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