Miniaturized FPGA Systems
Nallatech Miniaturized FPGA Systems solutions are a new class of ultra-compact computing systems for Size Weight and Power (SWaP) constrained applications including Unmanned Vehicles and Man-Packs.
These solutions enable all the processing and I/O resources required for sensor and signal processing functionality to be combined in a single ultra small form-factor solution.
Dedicated packaging with integrated thermal handling and ruggedization means that these solutions can be deployed in both commercial and harsh environments.
Benefits of Miniaturized FPGA Systems
- Size, Weight and Power (SWaP) benefits compared with multi-board line-card solutions
- Co-locates processing and sensor resources
- Reduced sensor-to-processing bandwidth requirements
- Rugged solutions for deployment in harsh environments
Miniaturized FPGA System Solutions
Nallatech miniaturized FPGA processing solutions can support multiple options on format, processing & networking and interconnect.
- Small form-factor board stacks approx 4” x 4” x 2” in size
- Custom and non-standard shapes/sizes
- Designed for stand-alone operation or PCB population
- Packaging options include:
- Resin overmolding
- Air or conduction-cooled metal casings
Processing & Networking Resources
- PowerPC and x86 Processors
- Memory including Flash, QDR & DDR SRAM, DDR2/3 SDRAM, RLDRAM
- Packet and circuit switches
- Digital I/O including FPDP, DVI, CameraLink, DisplayPort, LVDS, optical fiber
- Analog I/O including A/D & D/A converters
- Network I/O including XAUI, RS232, RS422, 1553, 10/100/1000 Ethernet, 10G Ethernet
- Processor Interfaces including PCI, PCI-Express, Serial RapidIO
Step 1: Rapid Prototype
Customer purchases off the shelf modular hardware, firmware & tools from Nallatech to develop image processing algorithm on FPGA.
Step 2: Optimize Design
Design is optimized to meet customer's specific requirements. Maximize performance while minimizing component count, power and cost.
Step 3: Optimize Packaging
Design is packaged to meet customer's form factor and reliability requirements, and ramped to production with in-house manufacturing
Step 4: Deploy