Miniaturized FPGA Systems

Nallatech Miniaturized FPGA Systems solutions are a new class of ultra-compact computing systems for Size Weight and Power (SWaP) constrained applications including Unmanned Vehicles and Man-Packs.
These solutions enable all the processing and I/O resources required for sensor and signal processing functionality to be combined in a single ultra small form-factor solution.
Dedicated packaging with integrated thermal handling and ruggedization means that these solutions can be deployed in both commercial and harsh environments.

Benefits of Miniaturized FPGA Systems

• Size, Weight and Power (SWaP) benefits compared with multi-board line-card solutions
• Co-locates processing and sensor resources
• Reduced sensor-to-processing bandwidth requirements
• Rugged solutions for deployment in harsh environments

Miniaturized FPGA System Solutions

Nallatech miniaturized FPGA processing solutions can support multiple options on format, processing & networking and interconnect.

Format

• Small form-factor board stacks approx 4” x 4” x 2” in size
• Custom and non-standard shapes/sizes
• Designed for stand-alone operation or PCB population
• Packaging options include:
  • Resin overmolding
  • Air or conduction-cooled metal casings

Processing & Networking Resources

• FPGAs
• PowerPC and x86 Processors
• Memory including Flash, QDR & DDR SRAM, DDR2/3 SDRAM, RLDRAM
• Microcontrollers
• Packet and circuit switches

Interconnect Resources

• Digital I/O including FPDP, DVI, CameraLink, DisplayPort, LVDS, optical fiber
• Analog I/O including A/D & D/A converters
• Network I/O including XAUI, RS232, RS422, 1553, 10/100/1000 Ethernet, 10G Ethernet
• Processor Interfaces including PCI, PCI-Express, Serial RapidIO

Implementation

Step 1: Rapid Prototype Customer purchases off the shelf modular hardware, firmware & tools from Nallatech to develop image processing algorithm on FPGA.     Step 2: Optimize Design Design is optimized to meet customer's specific requirements. Maximize performance while minimizing component count, power and cost.     Step 3: Optimize Packaging Design is packaged to meet customer's form factor and reliability requirements, and ramped to production with in-house manufacturing   Step 4: Deploy